|
2012-02-06
New Analog Devices’ PLL Synthesizers Deliver Utmost Flexibility and Phase Noise Performance
|
|
2012-02-03
FCI’s PwrBlade+™ Connector Provides Higher Linear Current Density
|
|
2012-02-03
FCI Launches Next-Generation SAS Storage Interface
|
|
2012-02-03
Maxim's Hi-Speed USB Protectors Deliver Automotive-Grade Protection for Mobile Connectivity
|
|
2012-02-02
Fairchild Semiconductor to Showcase Major Power and Mobile Technology Innovations at IIC China 2012
|
|
2012-02-02
Texas Instruments unveils world’s smallest half duplex (HDX) RFID mini-transponders for animal and asset tracking
|
|
2012-02-01
Introducing TI’s SimpleLink product family: The industry’s broadest portfolio of easy-to-use wireless connectivity solutions
|
|
2012-01-31
3M Showcases its Growing Portfolio of 3M Twin Axial Cable Assembly Solutions at DesignCon 2012
|
|
2012-01-31
New Active Optical Cable Assemblies from 3M for CX4 and QSFP+ Applications Launch at DesignCon 2012
|
|
2012-01-31
FCI Unveils its Newest HD SAS Internal Cable Assemblies, featuring 3M Twin Axial Cable SL8800 Series, at DesignCon 2012
|
|
2012-01-31
TI’s MSP430™ MCUs provide flexible solution for next generation single-phase metering and energy monitoring applications
|
|
2012-01-31
FCI Introduces Multi-port and Single-port RJ45 Modular Jack Connectors
|
|
2012-01-31
3M Launches High Density Versions of its Embedded Capacitance Material at DesignCon 2012
|
|
2012-01-30
Bourns Releases New LSP (Open LED Shunt Protector) Products
|
|
2012-01-30
TI unveils fastest, highest-performance analog front end for femtocells and portable software-defined radio
|
|
2012-01-24
Cirrus Logic Energy Measurement ICs Offer Lowest Cost Solution While Optimizing Performance for Smart Grid Applications
|
|
2012-01-24
Renesas Electronics Announces Low-Loss Silicon Carbide (SiC) Power Device Series Integrating Power Conversion Circuit in a Single Package
|
|
2012-01-23
Multi-output Regulators with Supervisory and Watchdog Timers Reduce Component Count, Increase Power Density and Reliability
|
|
2012-01-20
Nuvoton Introduces First Audio SoC with ARM Technology
|
|
2012-01-19
Create intelligent and efficient lighting products with TI’s new Piccolo™ MCU digital AC LED Lighting and Communications Developer’s Kit
|
|
2012-01-18
TI’s new Bluetooth low energy system-on-chip increases battery life with 33 percent reduction in power consumption
|
|
2012-01-17
Maxim’s 3D Integration Technology Enables Industry’s Smallest Class D Amplifier Solution
|
|
2012-01-16
TI forges ahead in augmented reality on its OMAP platform, teams up with leaders metaio and Total Immersion
|
|
2012-01-14
AVX's 0402 MLOTM RF Inductors Offer Tight Tolerance in a Reduced Footprint
|
|
2012-01-13
TI’s OMAP platform transforms ordinary houses into smart, interactive homes
|
|
2012-01-13
SMSC's New JukeBlox 3.0 Connectivity Platform Delivers a Simple, Robust & Low Cost Platform to Enable WiFi® Speaker Docks at $129 Retail Price Points
|
|
2012-01-12
AVX Releases New MLO ™ Series 0402 Inductor
|
|
2012-01-12
TI’s OMAP platform amps up Windows 8 tablets with powerful visual and computing capabilities
|
|
2012-01-12
TI introduces ZigBee® RF4CE remote control solution for more advanced interactions with consumer electronics such as TVs, set-top boxes and game consoles
|
|
2012-01-12
SMSC’s Industry Leading KleerNet™ Technology Puts Monster’s New Wireless Audio Streaming Systems in a Class of Their Own!
|
|
2012-01-11
TI takes the driver’s seat with an unrivaled, full system solution for connected automotive infotainment
|
|
2012-01-10
TI introduces fastest 4-A and 5-A two-output MOSFET drivers for telecom and server power supplies
|
|
2012-01-10
3M Unveils Flat, Foldable HDMI Cable for the Consumer Market at CES 2012
|
|
2012-01-09
SMSC Launches Highly Integrated Wireless Headset Audio Processor With Tri-Band Support
|
|
2012-01-05
Maxim Introduces TINI® Family of Highly Integrated Solutions for the Consumer Market
|
|
2012-01-03
Bourns Adds MOV Products
|
|
2012-01-03
Maxim’s Optical Sensor Combines Ambient Light and Proximity Sensors to Deliver Optical Fusion
|
|
2011-12-23
AVX Showcases Electronics Innovation During Visit From Avnet Express & UBM Electronics' "Drive For Innovation" Tour
|
|
2011-12-23
AVX Recognized by Avnet as the 2011 Top Passive Supplier IP&E, Asia
|
|
2011-12-22
AVX's MAV Series Varistor Named a 2011 Hot 100 Product by UBM Electronics' EDN
|
|
2011-12-21
SMSC Targets Fast Growing Security Market with Customizable TrustSpan™ Secure Flash Storage and Smart Card Reader Controllers
|
|
2011-12-21
SMSC Targets Fast Growing Security Market with Customizable TrustSpan™ Secure Flash Storage and Smart Card Reader Controllers
|
|
2011-12-20
World-Leading Manufacturer AVX First in the Industry to Announce Validated Conflict-Free Tantalum
|
|
2011-12-20
Fairchild Semiconductor’s Digital Microphone Series Converts ECM Outputs to Digital PDM Data Streams, and includes Temperature Compensation
|
|
2011-12-16
TI introduces industry’s smallest power management ICs for solid state drives
|
|
2011-12-16
Renesas Electronics Introduces High-Commutation Power Semiconductor Device for Motor Drive in Electric Household Appliances Enabling Direct Trigger via a Microcontroller (MCU)
|
|
2011-12-15
Fairchild Semiconductor’s PWM Controller with mWSaver™ Technology Voted a Leading Product by EDN China
|
|
2011-12-15
Texas Instruments introduces industry’s most accurate amplifier for high common-mode voltage applications
|
|
2011-12-15
New GPS LNAs from NXP Dynamically Suppress Strong Transmit Signals
|
|
2011-12-14
Renesas Electronics Develops Industry's First 40nm Embedded Flash Memory Technology IP for Automotive Real-Time Applications
|